| 发明名称 |
Electronic Device and Method of Fabricating an Electronic Device |
| 摘要 |
A semiconductor device includes an electrically conducting carrier and a semiconductor chip disposed over the carrier. The semiconductor device also includes a porous diffusion solder layer provided between the carrier and the semiconductor chip. |
| 申请公布号 |
US2014042603(A1) |
申请公布日期 |
2014.02.13 |
| 申请号 |
US201213570783 |
申请日期 |
2012.08.09 |
| 申请人 |
HOSSEINI KHALIL;MAHLER JOACHIM;NIKITIN IVAN;BEER GOTTFRIED;INFINEON TECHNOLOGIES AG |
发明人 |
HOSSEINI KHALIL;MAHLER JOACHIM;NIKITIN IVAN;BEER GOTTFRIED |
| 分类号 |
B23K1/20;H01L21/78;H01L23/48;H01L23/495 |
主分类号 |
B23K1/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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