发明名称 MULTI-BAND INTERCONNECT FOR INTER-CHIP AND INTRA-CHIP COMMUNICATIONS
摘要 Systems, apparatus, modules, and methods of communicating with memory devices utilizing multi-band communication containing a baseband and one or more amplitude shift keyed (ASK) RF channels over each differential pair of off-chip transmission lines. Configurations are described for interfacing between microprocessors, or controllers and memory devices or modules, and within a DIMM and its DRAM devices, and between multiple DIMM memory modules.
申请公布号 US2014044157(A1) 申请公布日期 2014.02.13
申请号 US201313965077 申请日期 2013.08.12
申请人 THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 发明人 CHANG MAU-CHUNG;TAM SAI-WANG;BYUN GYUNG-SU;KIM YANGHYO;THERDSTEERASUKDI KANIT;IR JEREMY;REINMAN GLENN;CONG JINGSHENG
分类号 H04L25/02;H04L27/04 主分类号 H04L25/02
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