发明名称 |
MEMS Devices and Methods for Forming the Same |
摘要 |
A device includes a Micro-Electro-Mechanical System (MEMS) wafer having a MEMS device therein. The MEMS device includes a movable element, and first openings in the MEMS wafer. The movable element is disposed in the first openings. A carrier wafer is bonded to the MEMS wafer. The carrier wafer includes a second opening connected to the first openings, wherein the second opening includes an entry portion extending from a surface of the carrier wafer into the carrier wafer, and an inner portion wider than the entry portion, wherein the inner portion is deeper in the carrier wafer than the entry portion. |
申请公布号 |
US2014042562(A1) |
申请公布日期 |
2014.02.13 |
申请号 |
US201213571258 |
申请日期 |
2012.08.09 |
申请人 |
CHU CHIA-HUA;CHENG CHUN-WEN;LEE TE-HAO;LIN CHUNG-HSIEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHU CHIA-HUA;CHENG CHUN-WEN;LEE TE-HAO;LIN CHUNG-HSIEN |
分类号 |
H01L21/306;H01L29/84 |
主分类号 |
H01L21/306 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|