| 摘要 |
PURPOSE: An electromagnetic wave shielding film manufacturing process is provided to be applied to one side or both sides of a flexible printed circuit board (FPCB) by attenuating the electromagnetic wave of a printed circuit. CONSTITUTION: An electromagnetic wave shielding film includes an insulating layer, a metal layer, and a conductive adhesive layer. The insulating layer has a carrier film which is attached to one side thereof and has a thickness of 1.0-10 micrometers. The insulating layer is formed of a polyimide film. The metal layer is formed by coating and drying metallic ink on the upper surface of the insulating layer. The conductive adhesive layer is formed by coating and drying a conductive adhesive composition on the upper part of the metal layer. |
