| 摘要 |
A surface-mount package structure for reducing the ingress of moisture and gasesthereto is disclosed. The surface-mount structure includes a sub-module having adielectric layer, semiconductor devices attached to the dielectric layer, a first levelinterconnect structure electrically coupled to the semiconductor devices, and a secondlevel I/O connection electrically coupled to the first level interconnect and formed onthe dielectric layer, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module areattached to a substrate structure, with a dielectric material positioned between thedielectric layer and the substrate structure to fill in gaps in the surface-mount structure.A diffusion barrier layer is applied over the sub-module, adjacent the first and secondlevel I/O connections, and extends down to the substrate structure to reduce the ingressof moisture and gases from a surrounding environment into the surface-mount structure.Figure 126 |
