| 摘要 |
A polishing pad is disclosed which is less likely to cause scratches, and has an excellent planarization performance and polishing stability. In one aspect, the invention provides a polishing pad comprising an ultrafine fiber-entangled body formed of ultrafine fibers having an average fineness of 0.01 to 0.8 dtex, and a polymeric elastomer. The polymeric elastomer has a glass transition temperature of-10�C or below, storage moduli at 23�C and 50�C of 90 to 900 MPa, and a water absorption ratio, when saturated with water at 50�C, of 0.2 to 5 mass%. |
