SOLID-STATE IMAGE PICKUP DEVICE, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

摘要

A solid-state imaging apparatus in which heat dissipation and electromagnetic shielding can be efficiently performed is provided. The solid-state imaging apparatus includes: an MCM board 41 on which a sensor 42, and a SiP 44 that processes an output signal from the sensor 42 are mounted; a power supply board 61 on which a power supply IC 62 is mounted; and a shielding section 50 which is placed between the MCM board 41 and the power supply board 61 to cover the power supply IC 62, and which has an electrically conductive property and a thermally conductive property.