| 摘要 |
PURPOSE: An epoxy resin composition is provided to have excellent low absorption, low heat expansion, and high heat resistance. CONSTITUTION: An epoxy resin composition includes an epoxy resin, hardener, and inorganic filler as a main ingredient. The epoxy resin includes an epoxy resin represented by chemical formula 1. In chemical formula 1, R1 includes at least one benzene; and each of R2 and R3 is H or CH3. A heat radiating circuit board comprises a metal plate; an insulating layer formed on the metal plate; and a circuit pattern(300) formed on the insulating layer. The insulating layer is formed by curing the epoxy resin composition. |
