| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in heat resistance and low thermal expansion rate. SOLUTION: The epoxy resin composite material excellent in heat resistance and low thermal expansion rate is obtained by uniformly and finely dispersing an epoxy resin-curing accelerator containing at least a laminar clay mineral organized with an organic phosphonium ion represented by formula (1) (wherein, R<SB POS="POST">1</SB>and R<SB POS="POST">2</SB>are each H, CH<SB POS="POST">3</SB>, OH or OCH<SB POS="POST">3</SB>; n is an integer of 1 to 22) in an epoxy resin. COPYRIGHT: (C)2012,JPO&INPIT |
