| 摘要 |
An apparatus comprising: a flexible carrier substrate 102 comprising a substrate contact pad 104, 106 configured to allow electrical connection of a carried electronic component to one or more other carried electronic components 112; an electronic component 112 carried on the flexible carrier substrate, the electronic component comprising a component contact pad 114, 116 configured to allow electrical connection to the electronic component; and a curved interconnection 126 electrically interconnecting the respective substrate and component contact pads, wherein the curved interconnection is configured such that its curvature allows the interconnection to maintain its connection to the respective contact pads with operational flexing of the flexible carrier substrate. The curved interconnection removes the stress caused by flexing of the substrate. |
