| 摘要 |
<p>1,254,795. Semi-conductor devices. INTERNATIONAL BUSINESS MACHINES CORP. 18 June, 1969 [5 July, 1968], No. 30734/69. Heading H1K. A connector assembly consists of a substrate of semi-conductor material of one conductivity type having layers of insulating material on its opposed faces with aligned apertures therein between which extend diffused regions of the opposite conductivity type providing junction isolated connections between contacts on the opposed faces. Typically the substrate is a wafer of silicon with an oxide coating in which the apertures have been produced by standard photoresist and etching steps. Prior to the diffusion step the semi-conductor may be thinned between the aligned holes by etching. After diffusion a conductive pattern having terminations at the apertures are deposited on the oxide layers. The completed assembly 11, the undiffused part of which may be used as a power supply bus-bar, is sandwiched between one or more pairs of passivated silicon integrated circuit chips 12, 13 (Fig. 1), electrical contacts being made to desired points on the chips through solder reflow members which are held in place with adhesive prior to fusion. Finally one or more of the composite assemblies is mounted as shown on recessed ceramic base 36, with terminal portions of the conductive pattern on one face of the connector assembly in register with contacts 38 on the base to which they are soldered at such a temperature that the previously soldered joints remain intact.</p> |
