| 摘要 |
<p>Disclosed herein is a card device (1) including a semiconductor package section (23) having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section (3) having card-side terminals (7) for inputting and outputting information signals, and package-side terminals (30) at a location at which the semiconductor package section (23) is joined to the substrate section (21) by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section (23) by superposition. The substrate section (21) is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals (32). The superposition junction between the semiconductor package section (23) and the substrate section (21) is provided with such an offset that the card-side connector (3) protrudes out off the card device (1).</p> |
