发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
摘要 1,246,456. Mixed oxide, SiO 2 /TiO 2 , coating. MATSUSHITA ELECTRONICS CORP. 8 Nov. 1968 [22 Nov., 1967], No. 53067/68. Heading C1A. [Also in Division Hl] A PN junction device has a passivating layer including titanium dioxide and silica and containing 5-30% by volume of titanium dioxide. The layer may be homogeneous in which case it can be deposited by pyrolysis of a mixture of tetraethoxysilane and tetra-isopropyltitanate. The mixture, with some oxygen, is carried in a current of nitrogen or argon over the semiconductor surface which is maintained at 250- 500� C. Alternatively the layer may consist of a silica layer covered with titania, with or without an intervening layer of a mixture of the two oxides.
申请公布号 US3629666(A) 申请公布日期 1971.12.21
申请号 USD3629666 申请日期 1968.11.13
申请人 MATSUSHITA ELECTRONICS CORP. 发明人 MASAMI YOKOZAWA;HITOO IWASA
分类号 H01L21/316;H01L23/31;(IPC1-7):H01L9/00 主分类号 H01L21/316
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