| 发明名称 |
HIGH DENSITY MICROELECTRONICS PACKAGING |
| 摘要 |
Example packaging of microelectronics and example methods of manufacturing the same are provided herein. The packaging can enable and/or improve the use of the microelectronics in a downhole, high temperature and/or high pressure setting. The microelectronics packaging can include double-sided active components, heat sinks, and/or three-dimensional stacking of dies. |
| 申请公布号 |
EP2695188(A2) |
申请公布日期 |
2014.02.12 |
| 申请号 |
EP20120764630 |
申请日期 |
2012.03.29 |
| 申请人 |
SERVICES PETROLIERS SCHLUMBERGER;SCHLUMBERGER HOLDINGS LIMITED;SCHLUMBERGER TECHNOLOGY B.V.;PRAD RESEARCH AND DEVELOPMENT LIMITED |
发明人 |
DEFRETIN, HARMEL JEAN;XU, TAO;GARDNER, GLENN |
| 分类号 |
H01L23/12;H01L23/053;H01L23/10;H01L25/00;H01L25/04;H01L25/065;H01L25/16 |
主分类号 |
H01L23/12 |
| 代理机构 |
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