发明名称 CLEANER COMPOSITION FOR REMOVAL OF LEAD―FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD―FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD―FREE SOLDERING FLUX
摘要 The present invention provides a cleaner composition that can satisfactorily remove lead-free soldering flux adhered to the object to be cleaned, has little impact on the environment, and has odor, inflammability, etc., which are of an acceptable level for practical use; a rinsing agent for rinsing the cleaned object after cleaning with the cleaner composition to remove lead-free soldering flux more effectively; and a removal method using the composition (and the rinsing agent). The cleaner composition for the removal of lead-free soldering flux contains: (A) a polyoxyalkylene phosphate-based surfactant, (B) a metal chelating agent, and (C) a halogen-free organic solvent; and the rinsing agent for removal of lead-free soldering flux contains a carbonate represented by <?in-line-formulae description="In-line Formulae" end="lead"?>MaHb(CO3)C General Formula (7)<?in-line-formulae description="In-line Formulae" end="tail"?> where a is an integer of 1 or 2, b is an integer of 0 to 2, c is an integer of 1 or 2, and M is a volatile organic base.
申请公布号 KR101362301(B1) 申请公布日期 2014.02.12
申请号 KR20087021802 申请日期 2007.03.16
申请人 发明人
分类号 C11D1/34;C11D1/44;C11D1/74;C11D3/20 主分类号 C11D1/34
代理机构 代理人
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