| 摘要 |
<P>PROBLEM TO BE SOLVED: To sufficiently secure adhesiveness of two sorts of resins while configuring resin seal by using a high radiation resin and a low stress resin so as to secure heat radiation. <P>SOLUTION: An electronic circuit device 1 includes: a lead frame 2 on which heating components 6, 8 are mounted; the high radiation resin 13 molded so as to cover the radiation side of the lead frame 2; and the low stress resin 14 molded so as to cover the heating components 6, 8, the lead frame 2 and the high radiation resin 13 and to expose the radiation surface of the high radiation resin 13. When the low stress resin 14 is molded, the high radiation resin 13 is held in a half-cured state. <P>COPYRIGHT: (C)2010,JPO&INPIT |
