发明名称 |
METHOD FOR THE SEALED ASSEMBLY OF A SEALED ELECTRONIC HOUSING |
摘要 |
<p>A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.</p> |
申请公布号 |
EP2507825(B1) |
申请公布日期 |
2014.02.12 |
申请号 |
EP20100773931 |
申请日期 |
2010.11.10 |
申请人 |
THALES |
发明人 |
DREVON, CLAUDE;VENDIER, OLIVIER;BEN NACEUR, WALIM |
分类号 |
H01L21/50;H01L23/10 |
主分类号 |
H01L21/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|