SEMICONDUCTOR PACKAGE AND METH1OD OF FORMING TH1E SAME
摘要
<p>The present invention provides a semiconductor package and a method for manufacturing the same. A package substrate according to the present invention includes holes to allow a mold layer to cover the lower surface of the package substrate through the holes. The plane shape of the mold layer for covering the lower surface of the package substrate is vertically and horizontally symmetrical around the holes.</p>
