| 摘要 |
Disclosed is an apparatus for treating the surface of a substrate. According to one embodiment of the present invention, provided is the apparatus for treating the surface of the substrate, which includes: a vacuum chamber which receives the substrate; a fixing plate which is arranged in the vacuum chamber; a rotating member which is arranged to face the fixing plate; and a holder which is elastically installed on the rotating member, is in point contact with the substrate located in the vacuum chamber, and pressurizes the substrate to the fixing plate. |
