A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).
申请公布号
CA2581938(C)
申请公布日期
2014.02.11
申请号
CA20052581938
申请日期
2005.09.21
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
DODD, SIMON;WANG, S. JONATHAN;TOM, DENNIS W.;BRYANT, FRANK R.;MCMAHON, TERRY E.;MILLER, RICHARD TODD;HINDMAN, GREGORY T.
