发明名称 GLASS SYSTEM FOR HERMETICALLY CONNECTING CU COMPONENTS, AND HOUSING FOR ELECTRONIC COMPONENTS
摘要 An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.
申请公布号 KR20140017566(A) 申请公布日期 2014.02.11
申请号 KR20137022659 申请日期 2012.03.05
申请人 SCHOTT AG 发明人 HETTLER ROBERT;RINDT MATTHIAS
分类号 C03C8/20;H01L51/54 主分类号 C03C8/20
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