发明名称 |
Resin molded semiconductor device and manufacturing method thereof |
摘要 |
This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame. |
申请公布号 |
US8648452(B2) |
申请公布日期 |
2014.02.11 |
申请号 |
US201113176118 |
申请日期 |
2011.07.05 |
申请人 |
SAITO KIYOSHI;UMETANI YUJI;YOSHIMI HIDEAKI;SANYO SEMICONDUCTOR CO., LTD.;SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
SAITO KIYOSHI;UMETANI YUJI;YOSHIMI HIDEAKI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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