发明名称 Method for improving surface roughness of processed film of substrate and apparatus for processing substrate
摘要 A treatment apparatus for treating a substrate on a surface of which a treatment film has been formed and subjected to exposure processing and developing treatment. The treatment apparatus includes a nozzle for supplying a solvent gas of the treatment film to the surface of the treatment film on the substrate, and a moving mechanism for moving the nozzle which is supplying the solvent gas, relative to the substrate. The nozzle has an elongated discharge portion at least longer than a diameter of the substrate and partition plates at a front and a rear in the moving direction of the nozzle.
申请公布号 US8646403(B2) 申请公布日期 2014.02.11
申请号 US20090574503 申请日期 2009.10.06
申请人 INATOMI YUICHIRO;TOKYO ELECTRON LIMITED 发明人 INATOMI YUICHIRO
分类号 B05C11/00;B05B1/26;B05B1/28;B05B13/02;B05B15/04;B05C13/00;B05C13/02;B05C15/00;G03F7/40;H01L21/00;H01L21/027 主分类号 B05C11/00
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