发明名称 |
Method for improving surface roughness of processed film of substrate and apparatus for processing substrate |
摘要 |
A treatment apparatus for treating a substrate on a surface of which a treatment film has been formed and subjected to exposure processing and developing treatment. The treatment apparatus includes a nozzle for supplying a solvent gas of the treatment film to the surface of the treatment film on the substrate, and a moving mechanism for moving the nozzle which is supplying the solvent gas, relative to the substrate. The nozzle has an elongated discharge portion at least longer than a diameter of the substrate and partition plates at a front and a rear in the moving direction of the nozzle. |
申请公布号 |
US8646403(B2) |
申请公布日期 |
2014.02.11 |
申请号 |
US20090574503 |
申请日期 |
2009.10.06 |
申请人 |
INATOMI YUICHIRO;TOKYO ELECTRON LIMITED |
发明人 |
INATOMI YUICHIRO |
分类号 |
B05C11/00;B05B1/26;B05B1/28;B05B13/02;B05B15/04;B05C13/00;B05C13/02;B05C15/00;G03F7/40;H01L21/00;H01L21/027 |
主分类号 |
B05C11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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