发明名称 |
Apparatuses and methods for fabricating semiconductor packages |
摘要 |
An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed. |
申请公布号 |
US8647110(B2) |
申请公布日期 |
2014.02.11 |
申请号 |
US20100853545 |
申请日期 |
2010.08.10 |
申请人 |
CHOI YOUNGSHIN;JEONG KIKWON;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI YOUNGSHIN;JEONG KIKWON |
分类号 |
B29C45/14 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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