发明名称 |
Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate |
摘要 |
A semiconductor device includes a wafer level substrate having a plurality of first conductive vias formed through the wafer level substrate. A first semiconductor die is mounted to the wafer level substrate. A first surface of the first semiconductor die includes contact pads oriented toward a first surface of the wafer level substrate. A first encapsulant is deposited over the first semiconductor die. A second semiconductor die is mounted to the wafer level substrate. A first surface of the second semiconductor die includes contact pads oriented toward a second surface of the wafer level substrate opposite the first surface of the wafer level substrate. A second encapsulant is deposited over the second semiconductor die. A plurality of bumps is formed over the plurality of first conductive vias. A second conductive via can be formed through the first encapsulant and connected to the first conductive via. The semiconductor packages are stackable. |
申请公布号 |
US8648469(B2) |
申请公布日期 |
2014.02.11 |
申请号 |
US201113191386 |
申请日期 |
2011.07.26 |
申请人 |
CHOI DAESIK;KIM JONGHO;LEE HYUNGMIN;STATS CHIPPAC, LTD. |
发明人 |
CHOI DAESIK;KIM JONGHO;LEE HYUNGMIN |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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