| 摘要 |
An SMT system is provided to perform a mounting process after removing an oxide film of an electrode surface, thereby suppressing re-oxidation progressing by shortening a contact time between the electrode and air. An SMT system comprises a tray unit(10), a mounter unit(20), a camera unit(30), a laser unit(40), and a control unit(50). The tray unit supplies a surface-mounted device(1). The mounter unit mounts the surface-mounted device on a printed circuit board(2) by absorbing the surface-mounted device from the tray unit. The camera unit recognizes adsorption position information of the surface-mounted device, absorbed by the mounter unit, and electrode position information of the surface-mounted device. The laser unit irradiates laser beams to electrodes(1a) of the surface-mounted device and removes an oxide film of an electrode surface. The control unit receives the electrode position information of the surface-mounted device from the camera unit. |
