发明名称 |
A HEATLEAD FOR SEMICONDUCTOR PACKAGE |
摘要 |
The present invention relates to a heat sinking plane for a semiconductor package to significantly resolve problems relating to warpage reliability caused by the coefficient difference of thermal expansion between a semiconductor chip and a molding compound. The heat sinking plane for a semiconductor package significantly improves the quality and productivity in attachment works for a heat sinking plane during the manufacturing process of a semiconductor package. |
申请公布号 |
KR20140017209(A) |
申请公布日期 |
2014.02.11 |
申请号 |
KR20120083779 |
申请日期 |
2012.07.31 |
申请人 |
YOUNG YEIL PRECISION CO., LTD. |
发明人 |
CHU, DONG WOOK |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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