发明名称 Semiconductor device and semiconductor device manufacturing method
摘要 A semiconductor device including a semiconductor substrate having a logic formation region where a logic device is formed; a first impurity region formed in an upper surface of the semiconductor substrate in the logic formation region; a second impurity region formed in an upper surface of the semiconductor substrate in the logic formation region; a third impurity region formed in an upper surface of the first impurity region and having a conductivity type different from that of the second impurity region; a fourth region formed in an upper surface of the second impurity region and having a conductivity type different from that of the second impurity region; a first silicide film formed in an upper surface of the third impurity region; a second silicide film formed in an upper surface of the fourth impurity region and having a larger thickness than the first silicide film.
申请公布号 US8647944(B2) 申请公布日期 2014.02.11
申请号 US201313927855 申请日期 2013.06.26
申请人 RENESAS ELECTRONICS CORPORATION 发明人 SHINKAWATA HIROKI
分类号 H01L21/28;H01L21/8242;H01L21/02;H01L21/8239;H01L27/108 主分类号 H01L21/28
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