| 摘要 |
A method of manufacturing a light emitting device, the method including: disposing a semiconductor light emitting element including a semiconductor layer that emits a primary light on a mounting substrate; covering the semiconductor light emitting element with a transparent medium containing fluorescent material particles that absorb a part of the primary light and emits a secondary light having a wavelength longer than that of the primary light and scattering particles having a mean particle size D that satisfies the inequality 20 nm<D@0.4×lambda/pi, where lambda is the wavelength of the primary light propagating in the transparent medium; and precipitating the fluorescent material particles so as to form a fluorescent layer where the fluorescent material particles are mainly dispersed in the transparent medium and a scattering layer where the scattering particles are mainly dispersed in the transparent medium. |
