| 摘要 |
PURPOSE: A lead-free solder composition is provided to have excellent wettability and a melting point same as or lower than independently used solder. CONSTITUTION: A lead-free solder composition is composed of a Sn-Ag-Cu alloy containing 95.0-99.0 wt.% of Sn, 0.5-5 wt.% of Ag, and 0.1-2 wt.% of Cu; and a Sn-In alloy containing 45-55 wt.% of In and 45-55 wt.% of Sn. The lead-free solder composition is composed of 75-95 wt.% of the Sn-Ag-Cu alloy and 5-25 wt.% of the Sn-In alloy. The Sn-Ag-Cu alloy contains 96.5 wt.% of Sn, 3.0 wt.% of Ag, and 0.5 wt.% of Cu. [Reference numerals] (AA) Solder containing two elements of Sn-In; (BB) Solder containing three elements of Sn-Ag-Cu |
