TAPE PAKAGE AND DISPLAY APPARATUS HAVING THE SAME

摘要

A tape package comprises a base substrate; an input lead wire which is arranged on the base substrate and includes a main input lead wire and a sub input lead wire branched from the main input lead wire; an IC chip which is electrically connected to the sub input lead wire; and a sealing part which is arranged to fix the IC chip in the base substrate and to cover at least a portion of the main input lead wire. By arranging a bottleneck area where the main input lead wire and the sub input lead wire are connected in the lower part of the sealing part, although the tape package is bent by external force, the base substrate corresponding to the bottleneck area by the sealing part is not bent, thereby preventing circuit pattern from being disconnected in the bottleneck area.