| 摘要 |
PURPOSE: A vacuum chuck for manufacturing a mold type wafer is provided to prevent leakage of vacuum pressure, by installing an O-ring between a porous ceramic and a vacuum hole of a plate. CONSTITUTION: An aluminum base is installed in the lower part of a wafer. A porous ceramic is inserted into the lower part of the aluminum base through-hole hooped swell. A plate (3) is installed in the lower part of the porous ceramic. A silicon pad ring (4) is installed in the lower part porous ceramic hooped swell of the porous ceramic. An internal O-ring (5) is installed in a hole connected to a vacuum pump. |
