发明名称 METHOD FOR TREATING METAL FILM AND TREATMENT DEVICE
摘要 A method for processing a metal film includes adiabatically expanding a mixed gas including an oxidation gas, a complexing gas and a rare gas in a processing chamber having a vacuum exhaust device such that a gas cluster beam is generated in the processing chamber, and irradiating the gas cluster beam upon a metal film formed on a surface of a workpiece in the processing chamber such that the gas cluster beam collides on the metal film including a metal element and the metal film is etched. The mixed gas includes the oxidation gas which oxidizes the metal element and forms an oxide, and the complexing gas which reacts with the oxide and forms an organometallic complex
申请公布号 KR20140016884(A) 申请公布日期 2014.02.10
申请号 KR20137019681 申请日期 2012.01.17
申请人 TOKYO ELECTRON LIMITED 发明人 GUNJI ISAO;MIYOSHI HIDENORI;HARA KENICHI
分类号 H01L21/3065;C23F4/00;H01J37/317 主分类号 H01L21/3065
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