| 摘要 |
A method for scrap processing of the products of electronic engineering includes scrap grinding, separation thereof, annealing and melting of the resulting multicomponent material using a copper collector, at that after the grinding and separation the formed fraction is packaged by the portions and it is sent to a melting-annealing furnace into the heat treatment unit, which is equipped with a plasma torch, providing a process temperature up to 2000 °C wherein annealing and melting are simultaneously combined, at that the fraction which is packaged by portions during its movement in the thermal processing unit is heated by convective flows of the heated gas in the said unit, and the ingots containing the noble and base metals are formed from the resulting melt. |
