发明名称 |
PREPREG, METAL-FOIL-CLADDED LAMINATE BOARD, AND PRINTED WIRING BOARD |
摘要 |
<p>There are provided a prepreg having low water absorption, and of which deterioration in insulation resistance over time is remarkably suppressed, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).</p> |
申请公布号 |
KR20140016910(A) |
申请公布日期 |
2014.02.10 |
申请号 |
KR20137025420 |
申请日期 |
2012.03.15 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
ARII KENJI;NOMIZU KENTARO;SOGAME MASANOBU |
分类号 |
C08J5/24;B32B15/08;B32B15/092;C08G10/04;C08G59/62;H05K1/03 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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