发明名称 CHIP EJECTOR AND CHIP REMOVAL METHOD USING THE SAME
摘要 <p>A chip ejector according to an embodiment of the present invention includes a fixing part; and a transferring part arranged on the outside of the fixing part. The transferring part can sequentially fall together with a tape whose one surface is attached to an upper part thereof and can separate a chip attached at the other surface, from the tape.</p>
申请公布号 KR20140015851(A) 申请公布日期 2014.02.07
申请号 KR20120081465 申请日期 2012.07.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JOO, YONG HUI;PARK, SUNG KEUN;JWA, KYUNG SUN;OH, JUNG MI;JANG, BUM SIK
分类号 H01L21/677;B65G49/07;H01L21/50;H05K13/02 主分类号 H01L21/677
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