| 摘要 |
A light-emitting diode package and a manufacturing method thereof are provided to improve the reliability by uniformly emitting the white light. A light-emitting diode package(100) comprises the lower and upper cavities(112,116), leads(118,119), an emitting device(120), the first molded member(130), and the second molded member(140). The lower and upper cavities are restricted into bodies(110,111,115). The leads are exposed to the lower and upper cavities through the body. The emitting device is arranged on the selected lead. The first molded member has the first fluorescent substance(132). The first molded member is arranged on the lower cavity. The second molded member has the second phosphor(142). The second molded member is arranged on the upper cavity. |
