SURFACE PROTECTING ADHESIVE FILM FOR SEMICONDUCTOR WAFER AND METHOD MANUFACTURING THE SAME

摘要

The present invention provides an adhesive film comprising: a base film in which an area ratio (B/A) of a tension elastic area (B) for a tension plasticity area (A) is 0.015 or less, and an elongation percentage is 250% or more; and an adhesive layer formed on the base film. The present invention also provides a method for manufacturing an adhesive film comprising: a step of preparing a composite including a urethane acrylate oligomer and an acrylate monomer; a step of forming a base film by hardening the composite; and a step of forming an adhesive layer on the base film. The base film has an area ratio (B/A) of a tension elastic area (B) for a tension plasticity area (A) of 0.015 or less, and an elongation percentage of 250% or more.