| 摘要 |
An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a non-conductive adhesive agent having a low minimum melt viscosity and having no conductive particle where a thin electronic component having a thickness smaller than or equal to 200 µm is mounted on a wiring board. In the mounting apparatus, a non-conductive adhesive film (300) having the minimum melt viscosity lower than or equal to 1.0 × 10 3 Pa·s is placed on a wiring board (100) placed on a base (11), and an IC chip (200) having a thickness smaller than or equal to 200 µm is placed on the non-conductive adhesive film (300). In the mounting apparatus, the IC chip (200) is pressurized by a thermocompression bonding head (12) having a compression bonding portion (14) made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip (200) is bonded onto the wiring board (100) by thermocompression. |
