发明名称 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 The purpose of the present invention is to provide an electronic component that is insensitive to changes in environmental temperature and with improved waterproofness without upsizing the outer size and a method of manufacturing the electronic component. An electronic component (a connector) includes a body (100) having insulation properties, a contact (200a), and a first sealant (300a). The contact (200a) includes first and second fixed portions (210a, 220a) formed at the body (100) and a tail portion (240a) protruding out from the body (100). The first sealant (300a) is non-volatile oil filled in gaps (S1, S2) between the body (100) and the first and second fixed portions (210a, 220a) of the contact (200a).
申请公布号 KR20140016156(A) 申请公布日期 2014.02.07
申请号 KR20130075043 申请日期 2013.06.28
申请人 HOSIDEN CORPORATION 发明人 NAGATA TAKAYUKI;SASAKI DAISUKE
分类号 H01R24/38;H01R13/50;H01R43/00 主分类号 H01R24/38
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