LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided are a LED package and a method of manufacturing the LED package. The LED package comprises: a base substrate forming a first recess on the upper surface and a second recess on the lower surface; an upper surface insulating layer formed on the upper surface of the base substrate; a lower surface insulating layer formed on the lower surface of the base substrate; a first electrode and a second electrode passing through the base substrate and formed on the upper part of the upper surface insulating layer and the lower part of the lower surface insulating layer; a LED chip electrically connecting to the first electrode and the second electrode and formed on the first recess; and a mold sealing the first recess.