HEAT DISSIPATION PLATE

摘要

A heat dissipation plate (4) is provided with: a substantially rectangular heat transfer surface (4A) in contact with an electronic component (2); side walls (4C) respectively arranged around the four sides of the heat transfer surface (4A); and a heat dissipation base surface (4J) connected to the heat transfer surface (4A) by the side walls (4C). The heat dissipation plate (4) is configured in such a manner that heat generated by the electronic component (2) is received by the heat transfer surface (4A), transmitted from the heat transfer surface (4A) to the heat dissipation base surface (4J) through the side walls (4C), and dissipated from the heat dissipation base surface (4J). At least one of the side walls (4C) is provided with air passage holes (4E).