发明名称 CONTACTING MEANS AND METHOD FOR CONTACTING ELECTRICAL COMPONENTS
摘要 The present invention provides a method for connecting two or more components using a sintering preform. The sintering preform comprises a carrier having a surface having one or more structural components including a hardened paste. The hardened paste comprises a metal particle and one or more sintering supplements. The metal particle comprises coating which comprises one or more organic compounds (a). The sintering supplements are selected from a group comprising organic peroxides (b), (b1), a mineral peroxide (b2), a mineral acid (b3), a salt of an organic acid having one to four carbon particles (b4), an ester of the organic acid having the one to four carbon particles (b5), and a carbonyl complex (b6). The surface of the carrier having the hardened paste has non reactivity for the components of the paste.
申请公布号 KR20140014328(A) 申请公布日期 2014.02.06
申请号 KR20110089804 申请日期 2011.09.05
申请人 HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG 发明人 SCHAEFER MICHAEL;SCHMITT WOLFGANG
分类号 H01L21/60;H01L23/482;H05K3/32 主分类号 H01L21/60
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