WORKPIECE CONVEYING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent a wafer holding mechanism of a conveying mechanism from being brought into contact with a semiconductor wafer even if a joint position on a glass substrate of the semiconductor wafer is deviated from an ideal position.SOLUTION: A workpiece conveying device for conveying a workpiece includes a substrate layer and a layer to be processed on a part of the substrate layer. The workpiece conveying device includes a workpiece holding mechanism configured to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one workpiece holding surface having a taper to hold the substrate layer of the workpiece in a state in which the layer to be processed is located under the substrate layer. The workpiece holding surface having the taper is configured in such a manner that a prescribed distance R or a clearance whose size is equal to R or more exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism.