发明名称 INFRARED RADIATION ELEMENT
摘要 <p>The infrared radiation element (1) of the present invention comprises: a substrate (2); a thin film section (3) that is provided to the surface (201) side of the substrate (2); a through hole (2a) that passes through the substrate (2) in the thickness direction thereof; and a first infrared radiation layer (4a) that has a grid-like form and that is provided to the side of the substrate (2) that is opposite from the side to which the thin film section (3) is provided. The infrared radiation element (1) comprises: a plurality of pads (9) that are electrically connected to the first infrared radiation layer (4a); and a second infrared radiation layer (4b) that is arranged so as to be separated from the first infrared radiation layer (4a) at the opening (4aa) of the first infrared radiation layer (4a), and that has a higher infrared radiation rate than the thin film section (3).</p>
申请公布号 WO2014020797(A1) 申请公布日期 2014.02.06
申请号 WO2013JP02386 申请日期 2013.04.08
申请人 PANASONIC CORPORATION 发明人 KIRIHARA, MASAO;TSUJI, KOJI;YOSHIHARA, TAKAAKI;NAGATANI, YOSHIHARU;MATSUNAMI, HIROTAKA
分类号 G01N21/01;G01J1/08;G01N21/35 主分类号 G01N21/01
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