| 摘要 |
The present invention provides a pressure sensor simplifying a manufacturing process and having a small size and an excellent sensitivity. According to an embodiment of the present invention, the pressure sensor comprises a circuit board in which cavities are formed; a pressure seating layer changed by external pressure and located to seal the cavities on the circuit board; and a pressure sensing layer located at the lower side of the pressure seating layer by being projected from the circuit board within the cavities and for sensing pressure according to the change of electric resistance values with residual stress generated with the change of the pressure seating layer. |
