DEVICE FOR MAUNFACTURING OF SEMICONDUCTOR TRAY AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a manufacturing device for a semiconductor chip tray and a manufacturing method thereof. The manufacturing device for a semiconductor chip tray according to the present invention comprises: a first mold unit and a second mold unit which includes a cavity in which a molten resin is injected into the inner space by being contacted to each other and a gate formed in one among the first mold unit and second mold unit; and a first cooling line and a second cooling line which are respectively installed at the first mold unit and second mold unit and the molten resin cooled. At least one among the first cooling line and second cooling line includes a connection cooling line in which cooling fluids are drawn in and out to the inner space and a main cooling line which is connected to the connection cooling line and formed to be more adjacent towards the cavity than the connection cooling line. Accordingly, the present invention provides the manufacturing device for a semiconductor chip tray capable of preventing flexure or distortion by making the cooling speed of a molded product uniform in the manufacture of a semiconductor chip tray and removing the residual stress of the semiconductor chip tray.