发明名称 CHIP EJECTOR AND CHIP REMOVAL METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a chip ejector and a chip attachment and separation method capable of suppressing damage to a chip such as cracks and breakdowns, thereby preventing wasted costs due to defective chips and separating the chip from a tape stably.SOLUTION: A chip ejector 100 includes: a fixing unit 130; and conveying units 140 disposed outside the fixing unit 130. The conveying units 140 descend together with a tape 120 having one surface attached to upper portions of the conveying units 140, and separate a chip 110 attached to the other surface of the tape 120 from the tape 120.
申请公布号 JP2014027246(A) 申请公布日期 2014.02.06
申请号 JP20120213979 申请日期 2012.09.27
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JOO YONG HUI;PARK SUNG KEUN;JWA KYUNG SUN;OH JUNG MI;JANG BUM SIK
分类号 H01L21/67;H01L21/301 主分类号 H01L21/67
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