发明名称 |
CHIP EJECTOR AND CHIP REMOVAL METHOD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a chip ejector and a chip attachment and separation method capable of suppressing damage to a chip such as cracks and breakdowns, thereby preventing wasted costs due to defective chips and separating the chip from a tape stably.SOLUTION: A chip ejector 100 includes: a fixing unit 130; and conveying units 140 disposed outside the fixing unit 130. The conveying units 140 descend together with a tape 120 having one surface attached to upper portions of the conveying units 140, and separate a chip 110 attached to the other surface of the tape 120 from the tape 120. |
申请公布号 |
JP2014027246(A) |
申请公布日期 |
2014.02.06 |
申请号 |
JP20120213979 |
申请日期 |
2012.09.27 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
JOO YONG HUI;PARK SUNG KEUN;JWA KYUNG SUN;OH JUNG MI;JANG BUM SIK |
分类号 |
H01L21/67;H01L21/301 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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