| 摘要 |
PROBLEM TO BE SOLVED: To provide polishing compositions and methods that exhibit reduced microwaviness in memory or rigid disks.SOLUTION: The invention provides a chemical-mechanical polishing composition consisting essentially of fumed alumina, alpha alumina, silica, 10-1000 ppm of a nonionic surfactant, 0.8-1.5 mass% of an additive compound selected from the group consisting of glycine, alanine, iminodiacetic acid, and maleic acid, hydrogen peroxide, optionally a biocide, and water. The invention further provides a method of chemically-mechanically polishing a substrate, the method comprising contacting a substrate with a polishing pad and the polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate. |
