发明名称 PATTERN FORMING METHODS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 According to one embodiment, a pattern forming method includes forming a self-assembled material on a plurality of first patterns, forming a plurality of second patterns by heating the self-assembled material and causing microphase separation of the self-assembled material, the second patterns corresponding to the first patterns, and calculating positional deviations of respective positions of the second patterns from positions of the corresponding first patterns. When at least one of the positional deviations is larger than a predetermined value, the self-assembled material is adjusted.
申请公布号 US2014038318(A1) 申请公布日期 2014.02.06
申请号 US201313767168 申请日期 2013.02.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SATO HIRONOBU
分类号 B05D1/36 主分类号 B05D1/36
代理机构 代理人
主权项
地址